Die package having an adhesive flow restriction area

ABSTRACT

A die package having an adhesive flow restriction area. In a first embodiment, the adhesive flow restriction area is formed as a trench in a transparent element. A second embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches that extend from one edge of the transparent element to the other edge. A third embodiment has a transparent element with an adhesive flow restriction area formed as a plurality of trenches. A fourth embodiment has a transparent element with an adhesive flow restriction area formed as a protuberance. A fifth embodiment comprises a trench in the die. A sixth embodiment has a die with a plurality of trenches in the die as an adhesive flow restriction area. A seventh embodiment has a die with a protuberance.

FIELD OF THE INVENTION

The present invention relates to a die package; specifically, a diepackage having an adhesive flow restriction area.

BACKGROUND OF THE INVENTION

Integrated circuits, including dies, for example, imager dies such ascharge-coupled-devices (CCD) and complementary metal oxide semiconductor(CMOS) dies, have commonly been used in photo-imaging applications. Suchdies typically contain thousands of pixel cells in a pixel array on asingle chip. Pixel cells convert light into an electrical signal thatcan then be stored and recalled by an electrical device such as, forexample, a processor.

Dies are typically packaged and inserted into imaging devices such as,for example, a digital camera. FIG. 1 illustrates a cross-sectional viewof one conventional die package 100. The die package 100 includes a die14 positioned on a substrate 10. The die 14 includes an array of pixels16. The die 14 typically has a transparent element 18 attached to asurface containing the array of pixels 16 by an adhesive material 24.

In operation, light radiation enters the transparent element 18 of thedie package 100. The transparent element 18 filters out IR radiationthat can cause color shifts due to cross talk between pixels in thearray of pixels 16. Light radiation is then adsorbed, and image signalsare created by the array of pixels 16, which converts the photons fromlight radiation to electrical signals. Wire bonds 13 conduct electricaloutput signals from the die 14 to wiring on the substrate 10, which, inturn, connects to external circuitry (not shown). The external circuitrymay include processing circuits for storing, compressing, manipulating,or displaying an acquired image.

The FIG. 1 die package 100 is formed by placing the die 14 on thesubstrate 10, applying adhesive material 24 on the periphery of the die14, and finally placing the transparent element 18 over the die 14. Theadhesive material 24 ensures that the transparent element 18 remainsattached to the die 14.

While the package illustrated in FIG. 1 works well, the adhesivematerial 24 often interferes with the array of pixels 16. During theprocess of attaching the transparent element 18 to the die 14, adhesivematerial 24 often covers the edge pixels of the array of pixels 16, asillustrated in FIG. 1. As the transparent element 18 is placed over thedie 14, capillary action, as well as the force pushing down on theadhesive material 24, may force the adhesive material 24 onto the arrayof pixels 16, thus interfering with the operation of the die 14. Thiscan lower the yield of packaged products and may affect the performanceof packaged products which pass yield tests.

The problem may also be present in packaged dies fabricated to havedisplay pixels, rather than pixels used to receive an image and convertit to electrical signals, resulting in poor visual quality.

BRIEF SUMMARY OF THE INVENTION

The present invention, in its various exemplary embodiments, provides adie package having an adhesive flow restriction area. In a firstembodiment, the adhesive flow restriction area is formed as a trench ina transparent element. In a second embodiment the adhesive flowrestriction area is comprised of a plurality of concentric trenches. Ina third embodiment the adhesive flow restriction area is comprised of aplurality of trenches that extend from edge to edge of the transparentelement. A fourth embodiment illustrates the adhesive flow restrictionarea comprised of a protuberance on a surface of the transparentelement. In a fifth embodiment, the adhesive flow restriction area iscomprised of a trench in a die. A sixth embodiment has a die with aplurality of concentric trenches comprising an adhesive flow restrictionarea. In a seventh embodiment, the adhesive flow restriction area iscomprised of a protuberance on a die.

BRIEF DESCRIPTION OF THE DRAWINGS

The above-described features of the invention will be more clearlyunderstood from the following detailed description, which is providedwith reference to the accompanying drawings in which:

FIG. 1 illustrates a cross-sectional view of a conventional die package;

FIG. 2 illustrates a cross-sectional view of a die package constructedin accordance with a first exemplary embodiment of the invention;

FIG. 3 illustrates a top-down view of a surface of the FIG. 2transparent element constructed in accordance with the first exemplaryembodiment of the invention;

FIGS. 4-9 illustrate cross-sectional views of stages in fabrication ofthe FIG. 2 die package in accordance with the first exemplary embodimentof the invention;

FIG. 10 illustrates a top-down view of a surface of a transparentelement constructed in accordance with a second exemplary embodiment ofthe invention;

FIG. 11 illustrates a cross-sectional view of a die package constructedin accordance with a third exemplary embodiment of the invention;

FIG. 12 illustrates a top-down view of a surface of the FIG. 11transparent element constructed in accordance with a third exemplaryembodiment of the invention;

FIG. 13 illustrates a cross-sectional view of a die package constructedin accordance with a fourth exemplary embodiment of the invention;

FIG. 14 a cross-sectional view of a die package constructed inaccordance with a fifth exemplary embodiment of the invention;

FIG. 15 illustrates a cross-sectional view of a die package constructedin accordance with a sixth exemplary embodiment of the invention; and

FIG. 16 illustrates a cross-sectional view of a die package constructedin accordance with a seventh exemplary embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof and show by way ofillustration specific embodiments in which the invention may bepracticed. These embodiments are described in sufficient detail toenable those skilled in the art to practice the invention, and it is tobe understood that other embodiments may be utilized, and thatstructural, logical, and electrical changes may be made withoutdeparting from the spirit and scope of the present invention. Theprogression of processing steps described is exemplary of embodiments ofthe invention; however, the sequence of steps is not limited to that setforth herein and may be changed as is known in the art, with theexception of steps necessarily occurring in a certain order.

The terms “transparent element” or “transparent plate” refer to anymaterial through which light radiation can pass, reflect, or refract.Materials that could form a transparent element include, but are notlimited to, glass, for example, zinc selenide (ZnSe),boro-phospho-silicate glass (BPSG), phosphosilicate glass (PSG),borosilicate glass (BSG), silicon oxide, silicon nitride, or siliconoxynitride; an optical thermoplastic material such as tantalum pentoxide(Ta₂O₅), titanium oxide (TiO₂), polymethylmethacrylate, polycarbonate,polyolefin, cellulose acetate butyrate, or polystyrene; a polyimide; athermoset resin such as an epoxy resin; a photosensitive gelatin; or aradiation curable resin such as acrylate, methacrylate, urethaneacrylate, epoxy acrylate, or polyester acrylate. The preceding materialsare only illustrative examples.

The term “adhesive flow restriction area” refers to any structuralfeature, provided on one or both of a transparent element and a die,which impedes the flow of an adhesive. Exemplary embodiments of theinvention illustrate the adhesive flow restriction area as one or moretrenches or protuberances provided on at least one of the transparentelement and die. The adhesive flow restriction area may be capable ofbreaking the wicking action of an aqueous solution into a smalltube-like structure, or channel. The adhesive flow restriction area maybe a separate channel which uses capillary action itself, and divertsaqueous solutions from one area to another. The adhesive flowrestriction area may also include a raised structure, or protuberance,that prevents the aqueous solution from entering a channel that thesolution may otherwise enter.

Referring now to the figures, where like reference numbers designatelike elements, FIG. 2 illustrates an exemplary die package 200constructed in accordance with a first embodiment of the invention.Specifically, the FIG. 2 die package 200 includes a die 14 containing anarray of pixels 16 electrically connected to a substrate 10 by wirebonds 13. The die package 200 includes an adhesive flow restriction area30 a formed in a lower surface 30 d of a transparent element 30, whichfaces the die 14. The transparent element 30 is attached to the die 14by an adhesive material 24.

As illustrated, the adhesive flow restriction area 30 a in thetransparent element 30 is a trench, or channel, designed to fill withany excess adhesive material 24 that has been placed on a periphery 14 bof the die 14 that might otherwise move onto and interfere with thearray of pixels 16 on the die 14 or the wire bonding 13. The adhesiveflow restriction area 30 a also interferes with any capillary actionwhich might otherwise occur between the lower surface 30 d of thetransparent element 30 and an upper surface 14 a of the die 14. Becausethe adhesive flow restriction area 30 a hinders the adhesive material 24from wicking onto and covering pixels of the array of pixels 16 on thedie 14, by capillary action, the packaged structure may have improvedimage quality and a higher yield.

The illustrated configuration may also provide more stability to theoverall die package 200. In this regard, the adhesive material 24located within the adhesive flow restriction area 30 a trench acts asposts to stabilize the transparent lens 30 in the die package 200.Because the surface of the adhesive material 24 is not flat, thetransparent lens 30 is less prone to sliding off the adhesive material24 during processing.

FIG. 3 illustrates a top-down view of a side of the FIG. 2 transparentelement 30 having the adhesive flow restriction area 30 a. Theillustrated adhesive flow restriction area 30 a at least partiallydefines a predefined area 30 b of the transparent element 30. Thepredefined area 30 b corresponds to the array of pixels 16 (FIG. 2) onthe die 14 (FIG. 2), or an array area 17 (illustrated as dotted lines).Typically, the predefined area 30 b is larger than the array area 17. Asdescribed above with respect to FIG. 2, the adhesive flow restrictionarea 30 b hinders the movement of the adhesive material 24 (FIG. 2) ontopixels in the array of pixels 16 (FIG. 2).

Although FIG. 3 illustrates an adhesive flow restriction area 30 a as atrench around an entire periphery of an array of pixels 16, it should benoted that the adhesive flow restriction area 30 a only needs to beprovided where an adhesive material 24 (FIG. 2) is used to connect thetransparent element 30 to the die 14 (FIG. 2). Accordingly, a continuousperipheral trench 30 a may not always be needed.

FIGS. 4-9 illustrate stages of an exemplary embodiment of a method offorming the FIG. 2 die package 200. As illustrated in FIG. 4, a die 14having an array of pixels 16 is positioned over a substrate 10. The die14 is electrically connected to conductive lines 7 on the substrate 10by wire bonds 13. The conductive lines 7 conduct electrical signals fromthe die 14 to external circuitry (not shown). For clarity's sake, theconductive lines 7 will be omitted from subsequent figures.

FIG. 5 illustrates adhesive material 24 deposited on the periphery 14 bof the die 14, outside of the periphery of the array of pixels 16. FIG.6 illustrates the transparent element 30 over the die. The transparentelement 30 is placed over the die such that a surface 30 d having anadhesive flow restriction area 30 a is facing the die 14, as depicted bythe patterned arrows. The trench forming the adhesive flow restrictionarea 30 a could be formed by any method known in the art. For example,the adhesive flow restriction area 30 a could be formed by chemicaletching, reactive ion etching (RIE), sawing, or other means of creatingan adhesive flow restriction area in the transparent element 30.

FIG. 7 illustrates the movement of the adhesive material 24. As thetransparent element 30 is positioned over and attached to the die 14,downward pressure, and capillary action, causes the adhesive material 24to move towards the array of pixels 16, as illustrated by the patternedarrows. As the transparent element 30 is further pressed onto the die14, as illustrated in FIG. 8, the adhesive material 24 moves furthertowards the array of pixels 16, and the adhesive material 24 now movesinto the trench of the adhesive flow restriction area 30 a rather thanover the array of pixels 16, due in part to capillary action. Themovement is further illustrated by the patterned arrows.

FIG. 9 illustrates the completed die package 200 including a transparentlens 30 attached to a die 14 by an adhesive material 24. The adhesivematerial 24, however, does not occlude an optical light path 11(illustrated as dotted lines) to the array of pixels 16 due to theadhesive flow restriction area 30 a preventing the movement of theadhesive material 24 onto the array of pixels 16.

Although the process has been described with reference to first placingthe adhesive material 24 (e.g., FIG. 4) onto the die 14 (e.g., FIG. 4),the adhesive material 24 could also first be placed on the transparentelement 30 (e.g., FIG. 5) before it is attached to the die 14 (e.g.,FIG. 5). The adhesive flow restriction area 30 a (e.g., FIG. 8) mayprevent the adhesive material 24 (e.g., FIG. 8) from moving onto thearray of pixels 16 (e.g., FIG. 9). Additionally, the adhesive material24 could hermetically seal a vacant space between the array of pixels 16(e.g., FIG. 9) and the transparent element (e.g., FIG. 9); or theadhesive material 24 can be applied over only a portion of the periphery14 b of the die 14 (e.g., FIG. 9) rather than to completely surround thearray of pixels 16.

FIG. 10 illustrates a transparent element 50 in accordance with a secondembodiment of the invention. The adhesive flow restriction area iscomprised of a plurality of trenches 50 a, 50 a′, 50 a″, 50 a′″ to atleast partially define a predefined area 50 b corresponding to an arrayarea 17. The plurality of trenches 50 a, 50 a′, 50 a″, 50 a′″ extendfrom edge to edge of the transparent element 50. As described above withrespect to FIGS. 7 and 8, adhesive material 24 may enter the trenches 50a, 50 a′, 50 a″, 50 a′″ rather than entering the array area 17 andoccluding the light path to at least some of the pixels of the array ofpixels 16. Additionally, because the trenches 50 a, 50 a′, 50 a″, 50 a′″extend to an edge of the transparent element 50, the adhesive material24 (FIG. 7) could exit the trenches from the edge of the transparentelement in the case that the trenches 50 a, 50 a′, 50 a″, 50 a′″ arefull, thereby preventing any adhesive material 24 (FIG. 8) from movingonto the array of pixels 16 (FIG. 8). The illustrated transparentelement 50 could be included in the FIG. 2 die package 200.

FIG. 11 illustrates a die package 300 constructed in accordance with athird embodiment of the invention. The illustrated die package 300 has atransparent element 40 having an adhesive flow restriction areacomprising two trenches 40 a, 40 a′ which prevent the adhesive material24 from occluding the optical light path 11 to the array of pixels 16.Additionally, the illustrated die package 300 has a flip-chip design, inwhich conductive pads 38 electrically connect the die 14 to externalcircuitry (not shown) by conductive tape 36. Although the trenches 40,40′ are illustrated with a curved shape, this is not intended to belimiting, as any profile providing a space which can be filled withadhesive material 24 will work.

FIG. 12 illustrates a top-down view of the FIG. 11 transparent element40 constructed in accordance with the third embodiment of the invention.The illustrated transparent element 40 has an adhesive flow restrictionarea comprising two trenches 40 a, 40 a′ that define a predefined area40 b. The predefined area 40 b corresponds to the array area 17(illustrated as dotted lines) on the die 14 (FIG. 11). The trenches 40a, 40 a′ fill with adhesive material 24 (e.g., FIGS. 7 and 8) duringprocessing, as discussed above with respect to FIGS. 4-9. Thus, anyadhesive material 24 which makes it past the outer peripheral trench 40a will be prevented from moving onto the array of pixels 16 by the innertrench 40 a′.

FIG. 13 illustrates a die package 400 constructed in accordance with afourth embodiment of the invention. The illustrated die package 400 hasan adhesive flow restriction area 60 a formed on a transparent element60. The transparent element 60, in turn, is placed over and attached tothe die 14. The illustrated adhesive flow restriction area comprises aprotuberance in the form of a mesa 60 a formed on a lower surface 60 bof the transmitting element 60, which prevents adhesive material 24 frommoving onto the pixels of the array of pixels 16. The protuberance 60 acould have a flat surface, such as a mesa, a pointed surface, or arounded surface. Additionally, the FIG. 13 die package 400 has anadhesive material 24 that completely encapsulates the wire bonds 13, forapplications in which the complete protection of the wire bonds 13 isdesired. The illustrated adhesive flow restriction area protuberance 60a could create a periphery around the periphery of the die 14, or theprotuberance 60 a could be formed only on locations on the transparentelement 60 where the adhesive material 24 is used to attach thetransparent element 60 to the die 14.

FIG. 14 illustrates a die package 500 constructed in accordance with afifth embodiment of the invention. The illustrated die package 500 hasan adhesive flow restriction area 70 a formed within a modified die 70.The adhesive flow restriction area comprises a trench on a surface ofthe modified die 70 having the array of pixels 16. The adhesive flowrestriction area 70 a breaks any wicking force, thereby preventing anyadhesive material 24 from moving onto the pixels of the array of pixels16. The adhesive flow restriction area trench 70 a could completelysurround a periphery of the array of pixels 16, or could simply beprovided only where the adhesive material 24 is used to attach thetransparent element 18 to the die 70.

FIG. 15 illustrates a die package 600 constructed in accordance with asixth embodiment of the invention. The illustrated die package 600 hasan adhesive flow restriction area comprising a plurality of trenches 80a, 80 a′ formed on a surface of a modified die 80 having an array ofpixels 16. The plurality of trenches 80 a, 80 a′ that break thecapillary action that might otherwise result in the adhesive material 24moving onto the pixels of the array of pixels 16. Thus, any adhesivematerial 24 which makes it past an outer peripheral trench 80 a will beprevented from moving onto the array of pixels 16 by an inner peripheraltrench 80 a′. The trenches 80 a, 80 a′ could be formed to extend to anedge of the die 80, so that if the trenches 80 a, 80 a′ fill withadhesive material 24, any excess adhesive material 24 could exit from anedge of the die 80.

FIG. 16 illustrates a die package 700 constructed in accordance with aseventh embodiment of the invention. The illustrated die package 700 hasan adhesive flow restriction area comprising a protuberance in the formof a mesa 90 a formed on a surface of a modified die 90 having an arrayof pixels 16. As the transparent element 18 is positioned over andattached to the modified die 90, the adhesive material 24 is preventedfrom moving onto the pixels of the array of pixels 16, due, in part, tothe adhesive flow restriction area 90 a. The illustrated adhesive flowrestriction area protuberance 90 a could create a periphery around theperiphery of the array of pixels 16 on the die 90, or the protuberance90 a could be formed only on locations on the die 90 where the adhesivematerial 24 is used to attach the transparent element 18 to the die 90.

It should be noted that although the shapes of the trenches andprotuberances comprising the adhesive flow restriction areas, e.g., 30a, 40 a, 50 a, 50 a′, 50 a″, 50 a′″, 60 a, 70 a, 80 a, 80 a′, 90 a, havebeen illustrated as rectangular or curved, the shapes of the adhesiveflow restriction areas are inconsequential to the operation of theinvention, and may constitute any shape such that adhesive material 24(e.g., FIG. 16) is prevented from moving onto the array of pixels 16(e.g., FIG. 16).

It should also be noted that the various embodiments of the inventionmay be used with dies (e.g., 14, 70, 80, 90) which have an array ofpixels 16 which converts an applied image to electrical signals, or todies (e.g., 14. 70, 80, 90) for image display, which have an array ofpixels 16 for generating an image in response to applied signals.

In addition, although each of the embodiments has been illustrated anddescribed as having one trench or protuberance or two trenches orprotuberances, this is not intended to be limiting. For example, a diepackage could be formed having a transparent element having an adhesiveflow restriction area comprising two or more trenches. Similarly, amodified die could be formed having an adhesive flow restriction areacomprising two or more concentric protuberances. Additionally, eachtrench or protuberance could be formed to extend from an edge to an edgeof either a transparent element or die.

The above description and drawings illustrate preferred embodimentswhich achieve the objects, features, and advantages of the presentinvention. Although certain advantages and preferred embodiments havebeen described above, those skilled in the art will recognize thatsubstitutions, additions, deletions, modifications and/or other changesmay be made without departing from the spirit or scope of the invention.Accordingly, the invention is not limited by the foregoing descriptionbut is only limited by the scope of the appended claims.

1-35. (canceled)
 36. A method of manufacturing an imaging device, saidmethod comprising: forming a die having a first surface, said firstsurface containing an array of imaging elements; forming a transparentelement having a first surface; forming at least one adhesive flowrestriction area on at least one of said first surfaces; and adhesivelyattaching said transparent element to said die such that said firstsurface of said transparent element faces said first surface of saiddie.
 37. The method of claim 36, wherein said adhesive flow restrictionarea is formed on said first surface of said transparent element. 38.The method of claim 37, wherein said act of forming an adhesive flowrestriction area comprises forming at least one trench.
 39. The methodof claim 38, wherein said act of forming at least one trench isperformed by reactive ion etching.
 40. The method of claim 38, whereinsaid act of forming at least one trench is performed by mechanicalsawing.
 41. The method of claim 38, wherein said act of forming at leastone trench creates a perimeter around said array of imaging elements.42. The method of claim 41, further comprising forming a second trenchcreating a perimeter around said at least one trench.
 43. The method ofclaim 38, wherein said act of forming said at least one trench furthercomprises forming at least one trench extending from edge to edge ofsaid transparent element.
 44. The method of claim 37, wherein said actof forming an adhesive flow restriction comprises forming at least oneprotuberance.
 45. The method of claim 44, wherein said act of forming atleast one protuberance is performed such that said protuberancesurrounds said imaging elements on said die.
 46. The method of claim 45,further comprising the act of forming a second protuberance such thatsaid second protuberance surrounds said at least one protuberance. 47.The method of claim 44, wherein said act of forming at least oneprotuberance is performed such that said at least one protuberanceextends from edge to edge of said transparent element.
 48. The method ofclaim 36, wherein said adhesive flow restriction area is formed on saidfirst surface of said die.
 49. The method of claim 48, wherein said actof forming an adhesive flow restriction area on said die comprisesforming at least one trench.
 50. The method of claim 49, wherein saidact of forming at least one trench creates a perimeter around said arrayof imaging elements.
 51. The method of claim 50, further comprisingforming a second trench creating a perimeter around said at least onetrench.
 52. The method of claim 49, wherein said act of forming said atleast one trench further comprises forming at least one trench extendingfrom edge to edge of said die.
 53. The method of claim 48, wherein saidact of forming an adhesive flow restriction comprises forming at leastone protuberance.
 54. The method of claim 53, wherein said act offorming at least one protuberance is performed such that said at leastone protuberance surrounds said imaging elements of said die.
 55. Themethod of claim 54, further comprising the act of forming a secondprotuberance such that said second protuberance surrounds said at leastone protuberance.
 56. The method of claim 53, wherein said act offorming at least one protuberance is performed such that said at leastone protuberance extends from edge to edge of said die.
 57. The methodof claim 36, wherein said imaging element is comprised of an array ofpixels, said pixels providing electrical signals corresponding to aresponse from light radiation.
 58. The method of claim 36, wherein saidimaging element is comprised of an array of pixels, said pixels capableof displaying an image corresponding to electrical signals.
 59. Themethod of claim 36, wherein said act of mounting said transparentelement to said die is performed such that a vacant space between saidtransparent element and said array of pixels is hermetically sealed bysaid adhesive material.
 60. The method of claim 36, further comprisingassociating said die with a substrate.
 61. The method of claim 36,further comprising electrically connecting said die to a conductive tapeby at least one conductive structure.
 62. The method of claim 61,wherein said at least one conductive structure comprises at least onesolder ball.